New

Thermal-Fluids and Space Thermal Engineer - Technical Staff

MIT Lincoln Laboratory
tuition reimbursement, 401(k)
United States, Massachusetts, Lexington
244 Wood Street (Show on map)
Sep 21, 2026
Select how often (in days) to receive an alert: JOIN OUR TALENT NETWORK Thermal-Fluids and Space Thermal Engineer - Technical Staff Apply now Date: Sep 21, 2026 Location: Lexington, MA, US Company: MIT Lincoln Laboratory The Structural & Thermal-Fluids Engineering Group (74) develops first-of-a-kind prototype systems across underwater, ground, air, and space domains for high-impact national security missions. Engineers work on advanced structural and material systems for space-based imaging and laser communications, thermal management solutions from cryogenic to hypersonic regimes, and aerodynamic design and assessment for unmanned aerial vehicles, airborne pods, and hypersonic platforms. Solutions are realized through the integration of high-fidelity analytical and computational modeling, multidisciplinary simulation, environmental testing, and advanced materials, addressing demanding performance, size, weight, power, and environmental constraints that are at the forefront of current engineering capabilities. The Group offers a collaborative, hands-on environment where engineers pair deep analytical expertise with direct ownership of hardware development, integration, and testing. Engineers are supported in their growth through mentorship and opportunities for increasing technical and programmatic leadership, participation in conferences and professional societies, and direct engagement with mission partners and government sponsors. Job Description Group 74 is seeking an engineer with strong expertise in thermal and thermal-fluid systems across multiple mission environments, including space, air, ground, and/or maritime domain. Strong candidates will be able to successfully lead and execute the design, analysis, development, integration, and testing of complex prototypes across concurrent programs. Candidates are expected to apply tools ranging from first-order analytical methods to high-fidelity FEA and CFD to generate actionable engineering insights that directly inform design decisions. Beyond analysis, the role includes hands-on ownership of hardware assembly, integration, and experimental testing (including test planning, execution, and data interpretation). The successful candidate will work within interdisciplinary teams to deliver operational prototype systems, spanning the full life cycle from early concept development through fabrication, test, and field deployment. Requirements Ph.D.(orMaster'sdegreeand at least 6years' experience)in Mechanical Engineering, Aerospace Engineering, or a related field Experience applying numerical simulation tools(e.g., COMSOL, ANSYS, AETD,IcePak) for thermal-fluid systems, such as electronics at the die,component, printed circuit board, and/or system levels Experience applying numerical simulation tools(specifically Thermal Desktopforspacecraft thermal systems Demonstrated ability to collaborate effectively within multidisciplinary engineering teams, including partnering with and influencing program partners who may not have thermal experience. Demonstrated ability to mentor and lead early career thermal and thermal-fluids engineers in small teams. Strong written and oral communication skills, with the ability to communicate complex technical results todiverse audiences. Ability to obtain andmaintaina security clearance. This position may require periodic travel to meetings and field sites. Recent Graduate Hiring Range:$145,200 - $170,000 Experienced Hiring Range: $145,200 - $220,000 Disclaimer: MIT Lincoln Laboratory provides a typical hiring range as a good faith estimate of what we reasonably expect to offer for this position at the time of posting. The final salary offered to a selected candidate will depend on various factors, including-but not limited to-the scope and responsibilities of the role, the candidate's experience, skills and education/training, internal equity considerations and applicable legal requirements. This range reflects base salary only and does not include additional forms of compensation or benefits. At MIT Lincoln Laboratory, our exceptional career opportunities include many outstanding benefits to help you stay healthy, feel supported, and enjoy a fulfilling work-life balance. Benefits offered to employees include: Comprehensive health, dental, and vision plans MIT-funded pension Matching 401K Paid leave (including vacation, sick, parental, military, etc.) Tuition reimbursement and continuing education programs Mentorship programs A range of work-life balance options ... and much more! Please visit our Benefits pagefor more information. As an employee of MIT, you can also take advantage ofother voluntary benefits, discounts and perks. Selected candidate will be subject to a pre-employment background investigation and must be able to obtain and maintain a Top Secret level DoD security clearance. MIT Lincoln Laboratory is an Equal Employment Opportunity (EEO) employer. All qualified applicants will receive consideration for employment and will not be discriminated against on the basis of race, color, religion, sex, sexual orientation, gender identity, national origin, age, veteran status, disability status, or genetic information; U.S. citizenship is required. Requisition ID:43374 Nearest Major Market: Boston Job Segment: Thermal Engineering, Security Clearance, R&D Engineer, Aerospace Engineering, Electronics Engineer, Engineering, Government Apply now Find similar jobs: Engineering