New

IC Package Substrate Engineer

Tesla Motors, Inc.
188,000 - 312,000 USD
paid holidays, flex time, 401(k)
United States, California, Palo Alto
Aug 07, 2026
What to Expect The Tesla AI Hardware team is at the forefront of revolutionizing artificial intelligence through cutting-edge hardware innovation. Comprising brilliant engineers and visionaries, the team designs and develops advanced AI chips tailored to accelerate Tesla's machine learning capabilities. Their work powers the neural networks behind Full Self-Driving (FSD), and Tesla humanoid robot, Optimus, pushing the boundaries of computational efficiency and performance. By creating custom silicon and optimized architectures, the team ensures Tesla remains a leader in AI-driven automotive and energy solutions, shaping a future where intelligent machines enhance human life. Tesla's AI Hardware team is looking for a highly motivated IC Package Substrate Engineer who will be part of an IC packaging team responsible for packaging substrates for Tesla's AI chip programs. This role involves IC package substrate development for different system applications including driving substrate process optimization/ characterizations, substrate and package level test, data analysis and NPI/MP of new package substrates. A successful candidate will have a strong background in IC package substrate engineering and be able to thrive in a highly dynamic environment. What You'll Do Drive substrate technology development to meet yield target and stringent reliability requirement for automotive SoC and other product segments Identify and qualify substrate vendors for different products by defining clear strategy/roadmap and driving qualification data collection to meet schedule for product launch Solve substrate process/material related technical issues by working with substrate vendors and internal teams closely Drive substrate process solutions for chip-packaging interaction issues Perform comprehensive substrate yield analysis and drive yield improvement at substrate vendors Support substrate technology development to high volume manufacturing transition to ensure smooth product launch Drive substrate pathfinding for future product needs What You'll Bring Master's Degree in related field or equivalent experience plus 2+ years' experience in IC packaging substrate field Excellent engineering problem solving skills with strong physics/fundamentals and excellent project management skills Good experience on IC package architecture and assembly process/material Must have deep understanding and knowledges on IC packaging substrate process, materials, design rules and qualification methodology Strong experience on working with internal and external x-functional teams Compensation and Benefits Benefits Along with competitive pay, as a full-time Tesla employee, you are eligible for the following benefits at day 1 of hire: Medical plans > plan options with $0 payroll deduction Family-building, fertility, adoption and surrogacy benefits Dental (including orthodontic coverage) and vision plans, both have options with a $0 paycheck contribution Company Paid (Health Savings Accounts) HSA Contribution when enrolled in the High-Deductible medical plan with HSA Healthcare and Dependent Care Flexible Spending Accounts (FSA) 401(k) with employer match, Employee Stock Purchase Plans, and other financial benefits Company paid Basic Life, AD&D Short-term and long-term disability insurance (90 day waiting period) Employee Assistance Program Sick and Vacation time (Flex time for salary positions, Accrued hours for Hourly positions), and Paid Holidays Back-up childcare and parenting support resources Voluntary benefits to include: critical illness, hospital indemnity, accident insurance, theft & legal services, and pet insurance Weight Loss and Tobacco Cessation Programs Tesla Babies program Commuter benefits Employee discounts and perks program Expected Compensation $188,000 - $312,000/annual salary + cash and stock awards + benefits Pay offered may vary depending on multiple individualized factors, including market location, job-related knowledge, skills, and experience. The total compensation package for this position may also include other elements dependent on the position offered. Details of participation in these benefit plans will be provided if an employee receives an offer of employment.